Master Syllabus

Thin Films in Nanofabrication

I. BASIC COURSE INFORMATION

  1. Course Title: Thin Films in Nanofabrication
  2. Course Number: NSC213
  3. Course Name: Nanoscience
  4. Credit Hours: 3
  5. Semesters Offered: TBA
  6. Prerequisite: Corequisites: NSC 211, NSC 212

 

II. COURSE DESCRIPTION

This course covers thin film deposition and etching practices in Nanofabrication. The deposition techniques to be included in the first part of the course will include atmosphere, low pressure, and plasma enhanced chemical vapor deposition and sputtering, thermal evaporation, and beam evaporation physical vapor deposition. Materials to be considered will include dielectrics (nitride, oxide), polysilicon (doped and undoped), metals (aluminum, tungsten, copper), adhesion promoters and diffusion barriers. The second part of the course will focus on etching processes and will emphasize reactive ion etching (single wafer, batch), high-ion-density reactors, ion beam etching and wet chemical etching. Students will receive hands-on experience in depositing and etching dielectric, semiconductor, and metal materials using state-of-the-art tools and practicing many of the steps critical to Nanofabrication of semiconductor devices including microelectronics, MEMs devices, display structures, and structures used in the biotechnology fields.

III. RATIONALE OF COURSE

Semiconductor-based Nanofabrication technologies are revolutionizing our society with wireless communications, computer technology, information technology and medical advances. The purpose of this course is to develop a full understanding of the use of, and of the processing involved in, the many uses of thin film materials in Nanofabrication. The emphasis of this course will be learning with and using state-of-the-art processing equipment in the Nanofabrication Facility cleanrooms. This is the third in a series of courses necessary for students to succeed as technicians in the Nanofabrication industry.

IV. COURSE COMPETENCIES

  1. Explain all chemical vapor deposition (CVD) processes used in nanofabrication.
  2. Compare the similarities and differences in all CVD equipment used in nanofabrication.
  3. Set up equipment to perform CVD.
  4. Operate equipment to perform CVD.
  5. Describe the uses of different CVD thin films in nanofabrication.
  6. Explain all physical vapor deposition (PVD) processes used in nanofabrication.
  7. Compare the similarities and differences in all PVD equipment used in nanofabrication.
  8. Set up equipment to perform PVD.
  9. Operate equipment to perform PVD.
  10. Describe the uses of different PVD thin films in nanofabrication.
  11. Explain the processes in wet chemical etching techniques used in nanofabrication.
  12. Compare the similarities and differences in all wet chemical etching equipment used in nanofabrication.
  13. Set up equipment to perform wet chemical etching.
  14. Operate equipment to perform wet chemical etching.
  15. Describe the uses of wet chemical etching techniques.
  16. Explain the processes in plasma etching techniques used in nanofabrication.
  17. Compare the similarities and differences in all plasma etching equipment used in nanofabrication.
  18. Set up equipment to perform plasma etching.
  19. Operate equipment to perform plasma etching.
  20. Describe the uses of plasma etching techniques.